Computer thiab Peripherals PCBA board

Peb qhov kev pabcuam:

Platforms rau kev suav txuas ntxiv mus ntxiv nrog rau kev ceev, muaj peev xwm thiab cov ntaub ntawv khaws cia / pauv.Qhov kev thov rau huab xam, cov ntaub ntawv loj, kev tshaj xov xwm, kev lom zem thiab kev siv xov tooj ntawm tes txuas ntxiv zuj zus thiab tsav qhov xav tau cov ntaub ntawv ntau ntxiv hauv lub sijhawm luv.


Product Detail

Khoom cim npe

Khoom feature

● -Material: Fr-4

● -Layer suav: 14 txheej

● -PCB Thickness: 1.6mm

● -Min.Kab / Qhov Chaw Sab Nraud: 4/4mil

● -Min.Drilled qhov: 0.25mm

● -Via Txheej Txheem: Tenting Vias

● -Surface Finish: ENIG

Cov yam ntxwv ntawm PCB qauv

1. Solderresistant number case (Solderresistant/SolderMask): Tsis yog txhua qhov chaw tooj liab yuav tsum tau noj cov khoom tin, yog li thaj chaw uas tsis yog-tin-noj yuav raug luam tawm nrog ib txheej ntawm cov khoom (feem ntau yog epoxy resin) uas cais cov tooj liab ntawm cov khoom noj tin mus rau zam tsis- soldering.Muaj ib qho luv luv ntawm cov kab tinned.Raws li cov txheej txheem sib txawv, nws muab faib ua roj ntsuab, roj liab thiab xiav roj.

2. Dielectric txheej (Dielectric): Nws yog siv los tswj cov rwb thaiv tsev ntawm cov kab thiab txheej, feem ntau hu ua substrate.

3. Kev kho deg (SurtaceFinish): Txij li cov tooj liab nto tau yooj yim oxidized nyob rau hauv ib puag ncig, nws tsis tuaj yeem tinned (tsis zoo solderability), yog li cov tooj liab nto yuav tsum tau tinned yuav tiv thaiv.Cov kev tiv thaiv muaj xws li HASL, ENIG, Immersion Silver, Immersion TIn, thiab organic solder preservative (OSP).Txhua txoj kev muaj nws qhov zoo thiab qhov tsis zoo, sib sau ua ke hu ua kev kho saum npoo.

SFSdvd (1)
SFSdvd (2)

PCB Techinecal Peev Xwm

Txheej Ntau lawm: 2 ~ 58 txheej / Pilot khiav: 64 txheej
Max.Thickness Ntau lawm: 394mil (10mm) / Pilot khiav: 17.5mm
Khoom siv FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead dawb cov khoom sib dhos), Halogen-Free, Ceramic puv, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Ib nrab hybrid, thiab lwm yam.
Min.Dav/Spacing Sab hauv: 3mil / 3mil (HOZ), Txheej txheej: 4mil / 4mil (1OZ)
Max.Tooj Thickness UL daim ntawv pov thawj: 6.0 OZ / Pilot khiav: 12OZ
Min.Qhov Loj Mechanical laum: 8mil (0.2mm) Laser laum: 3mil (0.075mm)
Max.Vaj Huam Sib Luag Loj 1150mm × 560mm
Aspect Ratio 18:1
Nto tiav HASL, Immersion Kub, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Kub ntiv tes
Txheej txheem tshwj xeeb faus qhov, qhov muag tsis pom kev, Embedded Resistance, Embedded Capacity, Hybrid, Ib nrab hybrid, Ib nrab siab ceev, Rov qab drilling, thiab Resistance tswj

  • Yav dhau los:
  • Tom ntej:

  • Sau koj cov lus ntawm no thiab xa tuaj rau peb