Tsheb Electronics PCBA board
Khoom feature
● -Kev kuaj kev ntseeg siab
● -Traceability
● -Kev tswj cua sov
● -Heavy tooj liab ≥ 105um
● -HDI
● -Semi - flex
● -Rigid - flex
● -High zaus milimeter microwave
Cov yam ntxwv ntawm PCB qauv
1. Dielectric txheej (Dielectric): Nws yog siv los tswj cov rwb thaiv tsev ntawm cov kab thiab txheej, feem ntau hu ua substrate.
2. Silkscreen (Legend/Marking/Silkscreen): Qhov no yog ib qho tsis tseem ceeb.Nws lub luag haujlwm tseem ceeb yog kos lub npe thiab lub npov ntawm txhua qhov ntawm lub rooj tsavxwm, uas yooj yim rau kev saib xyuas thiab txheeb xyuas tom qab sib dhos.
3.Surface kho (SurtaceFinish): Txij li thaum tooj liab nto tau yooj yim oxidized nyob rau hauv ib puag ncig, nws tsis tuaj yeem tinned (tsis zoo solderability), yog li cov tooj liab nto yuav tsum tau tinned yuav tiv thaiv.Cov kev tiv thaiv muaj xws li HASL, ENIG, Immersion Silver, Immersion TIn, thiab organic solder preservative (OSP).Txhua txoj kev muaj nws qhov zoo thiab qhov tsis zoo, sib sau ua ke hu ua kev kho saum npoo.
PCB Techinecal Peev Xwm
Txheej | Ntau lawm: 2 ~ 58 txheej / Pilot khiav: 64 txheej |
Max.Thickness | Ntau lawm: 394mil (10mm) / Pilot khiav: 17.5mm |
Khoom siv | FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead dawb cov khoom sib dhos), Halogen-Free, Ceramic puv, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Ib nrab hybrid, thiab lwm yam. |
Min.Dav/Spacing | Sab hauv: 3mil / 3mil (HOZ), Txheej txheej: 4mil / 4mil (1OZ) |
Max.Tooj Thickness | UL daim ntawv pov thawj: 6.0 OZ / Pilot khiav: 12OZ |
Min.Qhov Loj | Mechanical laum: 8mil (0.2mm) Laser laum: 3mil (0.075mm) |
Max.Vaj Huam Sib Luag Loj | 1150mm × 560mm |
Aspect Ratio | 18:1 |
Nto tiav | HASL, Immersion Kub, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Kub ntiv tes |
Txheej txheem tshwj xeeb | faus qhov, qhov muag tsis pom kev, Embedded Resistance, Embedded Capacity, Hybrid, Ib nrab hybrid, Ib nrab siab ceev, Rov qab drilling, thiab Resistance tswj |